Vertiv has launched the Vertiv™ MegaMod™ CoolChip,a liquid cooling-equipped prefabricated modular (PFM) data center solution engineered to enable efficient and reliable AI computing.
With demand for AI-ready data center capacity outstripping supply, developers and operators are focused on bringing new capacity online as quickly as possible. The new launch by Vertiv aims to support this goal.
The solution can be configured to support the platforms of leading AIcompute providers and scaled to customer requirements. By bringing together the quality and process efficiency enabled by offsite fabrication with best-in-class AI-ready technologies, MegaMod™ CoolChip can reduce the time to deploy AI critical digital infrastructure by up to 50 per cent.
Building on Vertiv’s experience developing other prefabricated modular data centers, MegaModCoolChip is designed to address the specific requirements of AI compute through a turnkey solution that integrates Vertiv™ CoolChip technology to support direct-to-chip liquid cooling, high-efficiency power protection and distribution, and other critical digital infrastructure technologies. The solution is available globally and can be used as a modular retrofit of an existing facility or as a new freestanding data center, supporting up to hundreds of kilowatts per row, up to multiple megawatts with prefabricated units.
By employing highly efficient advanced technologies, such as direct-to-chip liquid cooling and the Vertiv™ power infrastructure, MegaModCoolChip data centers can improve Power Usage Effectiveness (PUE) compared to data centers using traditional technologies, resulting in a lower carbon footprint, a release from Vertiv said.
Also read: Vertiv unveils next-generation UPS for data centres
