The European Investment Bank (EIB) is providing 24 million Euros in financing to Wirepas, a Finnish deep-tech company developing wireless connectivity for large-scale industrial Internet of Things (IoT) applications.
Wirepas will use the EIB backing to bolster research, development and innovation activities in Finland and France as well as business growth in Europe and beyond, a release by Wirepas said.
The EIB support takes the form of venture debt – a type of long-term financing for innovative, fast-growing companies that complements venture capital and other equity investment while limiting immediate dilution for existing shareholders.
The operation contributes to the InvestEU programme objective of promoting research, development and innovation across Europe. It also supports the EIB Group’s TechEU programme.
“Europe needs to scale technologies that can connect millions of devices reliably and at low cost,” said EIB Head of division for deep tech, digital and life sciences Yu Zhang. “Companies like Wirepas will help build the next generation of digital systems for industry, energy and cities. This is fully in line with Europe’s goals to strengthen digital sovereignty and accelerate the deployment of secure, energy-efficient technologies.”
Wirepas develops software that allows millions of devices to autonomously connect and communicate directly with each other instead of relying on traditional mobile networks. This makes it possible to build large, ultra-resilient and cost-efficient networks for critical infrastructure in areas such as energy grids, factories, buildings or cities.
At the core of the company’s technology is an open 5G standard for connecting large numbers of devices. Called NR+, the standard enables millions of devices to operate in the same network with high reliability and low energy use, supporting the European Union’s ambitions in digital infrastructure and industrial innovation.
“Resilient scalable connectivity is becoming a cornerstone of Europe’s digital infrastructure,” said Wirepas Chief Executive Officer Teppo Hemiä. “With the support of the EIB, we can accelerate the development and deployment of Wirepas technology across Europe and beyond, enabling industries and cities to connect millions of devices securely and efficiently. This financing strengthens our ability to innovate in Europe while supporting Europe’s ambitions for digital sovereignty and sustainable industrial transformation.”
Also read: Exclusive tndindia.com interview with Teppo Hemiä, CEO, Wirepas (December 2025)
Featured photograph (source: Wirepas) shows demonstration of interoperability of Wirepas NR+ technology